The low electrical loss inherent in thin glass solutions provides an optimal choice for next generation RF substrate needs particularly for 5G communications.
Thin glass substrates with low loss, low roughness and ability to scale to large area formats, makes glass very attractive to provide solutions for interposers and other packaging substrates.
Low roughness, optical transparency and hermetic performance of both the glass and the through glass vias (TGV) gives a multitude of opportunities to leverage these properties to enable MEMs applications.
Leveraging Mosaic’s thin substrate handling technology provides a cost-effective way to fabricate precision sensing components on thin glass substrates.
The ever increasing need for data and speed is driving the need for photonic solutions. Glass has a number of attributes that provide advantages as a photonic substrate.
Mosaic Microsystems has extensive experience with products in the microelectronics industry and in building successful companies across multiple industries.
