Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic packaging. Overcoming the challenges of handling, thinning, and cleaning <200 um thick […]
Mosaic Microsystems is excited to have demonstrated our temporary bond process at 300 mm!
Mosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, particularly for 5G, as well as MEMS and sensors for the internet of things (IoT) has […]
Microelectronics and photonics packaging company receives funding to further accelerate technology roadmap Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, has reported winning Small Business Innovative Research (SBIR) awards from the National Science Foundation (NSF) and […]