Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic packaging. Overcoming the challenges of handling, thinning, and cleaning <200 um thick wafers cost effectively prior to metallization is a key element in providing a robust, scalable process.
Mosaic’s thin glass solutions provide key performance characteristics such as low loss, CTE match, environmental stability, and cost effectiveness particularly desirable for 5G applications, as well as for MEMs and sensors for the internet of things (IoT). The proprietary Viaffirm™ temporary bond technology, uses innovative approaches to support thin glass substrates during downstream processing. This thin glass handling technology allows the supply chain to leverage the existing infrastructure, thereby unlocking the value that thin glass brings to next generation microelectronics and photonics applications.
Axus’ leading-edge CMP systems and tools help improve the polish performance of thin wafers by utilizing the Axus Crystal carrier, specifically designed for ultra-thin and fragile wafers, along with expert process development from our stellar foundry and development lab. Industry needs for glass wafers are being addressed in a prolific way by the processes that support bonding, debonding, and CMP of thin, fragile substrates.
Dan Trojan, President and CEO of Axus, commented “The development of processes and fragile wafer handling capabilities for thin glass wafers that we’re supporting in our partnership with Mosaic Microsystems is something we’re truly excited about. We believe this development will result in compelling solutions to difficult challenges in this evolving and growing market. We and our customers are already deeply involved in these types of applications, as evidenced by several of our recent new product introductions. These include Crystal wafer carriers, Crystal load stations, and last-but-not-least our new, state-of-the-art CapstoneTM CMP system. We believe that all of these products are the best solutions available in the industry for these types of materials and applications.”
Aric Shorey, Vice President of Business Development at Mosaic Microsystems, commented “We have been very pleased to work with Axus for our CMP and finishing needs and appreciate how they have seamlessly employed Mosaic’s Viaffirm™ temporary bond technology into their processes and been successful in finishing substrates as thin as 100 um from the start.”
About Axus Technology
Axus Technology is a recognized industry leader for equipment and process solutions for CMP, wafer thinning and wafer cleaning applications. Axus enables companies of all sizes from startups to high volume manufacturers to test, develop and implement leading-edge solutions, particularly for novel and emerging materials, process integration schemes, products and applications. Equipment solutions include low cost-of-ownership entry-level tools to state-of-the-art high-volume manufacturing systems. Process testing, development, optimization and scaling are supported by our process applications lab and foundry, which includes a full array of process equipment and supporting metrology, staffed by the most experienced team in the industry. For more information, please visit www.axustech.com.
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS and sensor technologies. We are proud to serve a number of industries and support their business goals with our proprietary technology. For more information, please visit www.mosaicmicro.com.
Mosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning
Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, particularly for 5G, as well as MEMS and sensors for the internet of things (IoT) has reported a significant investment into the business. Christine Whitman, Chairman and CEO of Mosaic Microsystems today announced it has agreed to a $2 million Seed round investment. Madison Hamman, Managing Director of BlueSky Capital, with close ties to Samtec Electronics, led the investment round with participation from Corning Incorporated (NYSE: GLW). Jeremy Wooldridge, General Manager of Samtec Microelectronics, will join Mosaic’s Board of Directors.
The seed financing builds on a strong year for Mosaic including securing an exclusive license from Corning for thin glass handling solutions, a Phase I NASA SBIR Contract to establish manufacturable implementation of thin glass for next generation electronics packaging and a growing list of customers developing their next generation products on thin glass. Mosaic has recruited technology experts from Kodak, Corning and ON Semiconductor to serve on the company’s leadership team.
“Mosaic’s offering is well-timed with the rapidly increasing demand for solutions that expand upon the performance of incumbent material choices, and drive business results,” said Madison Hamman. “We believe the market will continue to require new and differentiated thin substrate solutions for RF communications and advanced packaging. Mosaic is well positioned to establish these solutions for the industry and we are excited to collaborate with and support them as they work to build a great company in an exciting industry.”
Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
At the heart of Mosaic’s solution is a proprietary temporary bond technology, which uses innovative approaches to support thin glass substrates during downstream processing.
Key features and benefits of the Mosaic platform include:
An extremely thin temporary bonding layer, allowing for precision via fill with conductive materials using current semiconductor processes and equipment
Ability to process at elevated temperatures > 400˚C
No outgas from the temporary bond layer
A mechanical de-bond that leverages existing industry processes
“With our patented process, we are unlocking the advantages of thin glass solutions, while fully leveraging well-established processes and equipment in the existing supply chain to maximize the benefits, while minimizing cost,” said Mosaic Chairman and Chief Executive Officer. “With the financial support and domain expertise of Samtec Electronics, we will be able to execute our vision even more rapidly and broadly – and with the benefit of experience, perspective and relationships of our industry.” This investment from BlueSky Capital is the beginning of an exciting relationship with our newest partner with common strategic goals. This investment provides further foundation to build on an excellent 2019 to meet our goals in 2020 and beyond.
About Mosaic Microsystems Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY. Mosaic delivers robust solutions to enable thin glass products for exciting initiatives in RF communications, particularly for 5G, as well as advanced packaging, MEMS and sensors for the internet of things (IoT). Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
About BlueSky Capital BlueSky Capital is venture capital for seed-stage founders focused on component technologies and enabling hardware advances, with a focus on silicon, materials, optics, and sensors. We are independently controlled and financial returns-driven, but with deep ties to Samtec, Inc., that enable us to move quickly and invest with conviction.
Microelectronics and photonics packaging company receives funding to further accelerate technology roadmap
Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, has reported winning Small Business Innovative Research (SBIR) awards from the National Science Foundation (NSF) and Air Force Research Lab (AFRL)/AFWERX.
Mosaic’s glass handling solutions apply particularly for 5G, as well as for MEMs and sensors for the internet of things (IoT). The proprietary temporary bond technology, uses innovative approaches to support thin glass substrates during downstream processing. This exciting thin glass handling technology allows the supply chain to process thin glass leveraging the existing infrastructure, thereby unlocking the value that thin glass brings to next generation microelectronics and photonics applications.
NSF Phase II SBIR
America’s Seed Fund powered by NSF awards $200 million annually to startups and small businesses, transforming scientific discovery into products and services with commercial and societal impact. Startups working across almost all areas of science and technology can receive up to $1.5 million in non-dilutive funds to support research and development (R&D), helping de-risk technology for commercial success.
During the NSF Phase I SBIR project, Mosaic made significant progress on both technical and commercialization fronts establishing facility operations, extending on the base technology to enable commercial applications and providing capability to enable initial company sales. This NSF Phase II funding targets to build on these key achievements to increase process capability, robustness and further increase capacity.
AFWERX Phase I SBIR
AFRL and AFWERX have partnered to streamline the Small Business Innovation Research process in an attempt to speed up the experience, broaden the pool of potential applicants and decrease bureaucratic overhead. Beginning in 2018, and now in 2020, the Air Force has begun offering ‘Special’ SBIR topics that are faster, leaner and open to a broader range of innovations.
This Phase I SBIR award through AFWERX is an exciting program that partners Mosaic with the Electronics and Sensing facility within GE Research. Combining Mosaic’s innovative thin glass handling technology, the capabilities for fabricating advanced RF modules at GE Research and key technology from the Air Force Research Laboratory, allows Mosaic to lead the effort to establish critical next generation antenna technology in the Ka band. This innovative team will be establishing a key technology to enable enhanced satellite communications with significantly reduced size, weight and power. The objective is to leverage the aggressive approach of this AFWERX program to quickly transition the technology to the DoD customers.
Mosaic Chairman and Chief Executive Officer, Christine Whitman, stated “These awards are the culmination of an immense amount of work and focus from the Mosaic team over the past year. This adds to an exciting time for Mosaic as we continue to grow and accelerate our capabilities and work towards growing the business and addressing a wide range of opportunities in both commercial and defense applications.”
About Mosaic Microsystems
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY. Mosaic delivers robust solutions to enable thin glass products for exciting initiatives in RF communications, particularly for 5G, as well as advanced packaging, MEMs and sensors for the internet of things (IoT). Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
About GE Research:
GE Research is GE’s innovation powerhouse where research meets reality. GE’s scientists and engineers originate, develop and productize new technologies that create a better world and deliver differentiated products across the company’s industrial portfolio. These technologies span the defense, aviation, power, transportation and health care sectors. The Electronics and Sensing organization provides advanced prototype-to-production design, fabrication, assembly and test across diverse technologies for the military and industrial base.