Posted by NET2ad001 on | Comments Off on Entrepreneur of the Year Shelby F. Nelson, PhD
Shelby F. Nelson, PhD has been selected as the 2024 Entrepreneur of the Year by the Rochester Section of the American Chemical Society.
This award recognizes Dr. Nelson’s co-founding of Mosaic Microsystems and developing and commercializing innovative glass packaging technology for integration of microelectronic and photonic chips.
Mosaic’s proprietary glass handling technology allows temporary bonding of thin, flexible glass to a rigid handle wafer, to enable high-yield manufacturing of electrical and optical traces and circuits, leveraging industry standard processes normally used for silicon. This technology works with glass even below 100 microns thick.
Mosaic wants engineers who are involved in RF, computing, integrated photonics, and biomedical devices to know the benefits of glass for advanced semiconductor packaging.Glass can be thought of as a very high-performance printed circuit board (PCB) — enabling cutting-edge applications to meet their challenging targets.
Mosaic’s early understanding of the value of glass has been underscored by recent announcements by companies like Intel and Samsung of a drive to incorporate glass in their advanced packaging. Mosaic’s special expertise is in the production of thin glass packaging solutions, with successful (high yield) handling of the floppy and transparent material through the many steps required to produce finished packages.
Mosaic is prototyping thin glass with multi-layer interconnects, along with copper-filled through-glass vias connecting front to back of the glass, and is rapidly moving these to production for both defense and commercial industries.
Posted by David Levy on | Comments Off on Mosaic Awarded $1 Million from DBX Challenge
Mosaic Microsystems LLC proudly announces its success in winning a $1.0 million award as one of the competitors in the Defense Business Accelerator (DBX) Microelectronics Challenge. This strategic initiative, aimed at revolutionizing how the Department of Defense catalyzes commercial technology development, is both a significant milestone for Mosaic Microsystems and the start of an interesting new era in the broader defense technology landscape.
Mosaic Microsystems emerged as a finalist from a pool of over 270 applications, presenting their “Thin Glass Substrates for Advanced Microelectronics Packaging” solution at the Defense TechConnect Innovation Summit on November 28. A distinguished panel of industry, government, and investment experts evaluated the pitches, ultimately awarding seven winners a combined total of $10 million in funding.The DBX Microelectronics Challenge, a new program fostering innovation within the Department of Defense, serves as a catalyst for industrial base growth and private investment stimulation. By prioritizing commercial technology development, the challenge aims to expedite solution development and enhance the longevity of suppliers, ushering in a new era of collaboration between industry, government, and investment sectors. https://www.uspae.org/wp-content/uploads/2023/12/231204-USPAE-Release-DBX-Awardees.pdf
The DBX challenge is a collaborative effort, merging the electronics industry expertise of the U.S. Partnership for Assured Electronics (USPAE) and the Department of Defense’s Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP). Tactical support from Advanced Technology International (ATI), specifically the TechConnect division, further bolsters the challenge’s impact on the selected winners and the broader community.
Mosaic Microsystems showcased their innovative thin glass technology for advanced microelectronics packaging. The applications span various domains, including RF, compute, integrated photonics, and biomedical devices. Mosaic is prototyping thin glass with multi-layer interconnects, along with copper-filled through-glass vias connecting front to back of the glass, and will rapidly move these to production for both defense and commercial industries.
“We are pleased to have been selected for this prestigious award,” says Christine Whitman, CEO of Mosaic Microsystems. “The Defense Business Accelerator recognition validates our business strategy for expansion and underscores the critical role of Mosaic’s glass technology.”
Posted by David Levy on | Comments Off on Rochester Business Journal spotlights Mosaic for recent DOD award
RBJ spotlights Mosaic for a recent DOD award using its cutting edge glass interposers for an advanced high speed photonics packaging solution. Read the full article here.
Posted by David Levy on | Comments Off on Brittany Hedrick Joins Mosaic Microsystems as Integration Engineer
Mosaic Microsystems proudly announces the addition of Brittany Hedrick as Senior Engineering Manager. Brittany brings a wealth of experience in silicon photonics integration, wafer finishing, and packaging assembly, which will propel Mosaic’s innovative glass interposer solutions to new heights. Mosaic Microsystems, situated within the Eastman Business Park in Rochester, NY, is renowned for its rapid-paced application of thin glass towards replacing long standing silicon packaging solutions.
Brittany Hedrick joins Mosaic Microsystems from the role of Si Photonics Integration Engineer, with a robust professional background earned over the course of 12 years in the industry. She brings her expertise in a variety of fields, including 2.5D/3D packaging development, Si Photonics Post Fab enablement, and experience in the fabrication of both silicon and glass interposers. From her start as a Process Development Engineer to her role as Lead Post Fab Photonics Integrator, she has acquired a breadth of experience to apply at Mosaic.
“We are thrilled to welcome Brittany Hedrick to our team at Mosaic Microsystems,” said Shelby Nelson CTO of Mosaic Microsystems.
As the Senior Engineering Manager at Mosaic, Brittany will play a pivotal role in shaping the company’s future. Her responsibilities span from overseeing management of new projects to development of new glass packaging solutions. Brittany’s expertise will be instrumental in harmonizing processes, driving innovations in production quality, and addressing the diverse technical challenges presented by Mosaic’s clientele – which ranges from commercial customers to government contracts.
Posted by David Levy on | Comments Off on DoD Awards Contract to Mosaic Microsystems
DoD Awards Contract to Mosaic Microsystems to work with AIM Photonics on cutting-edge glass-based electronic and photonic interposers
Mosaic Microsystems, a pioneering leader in advanced microelectronics glass packaging technology, is delighted to announce the successful award of a Phase II Small Business Innovation Research (SBIR) contract by the Department of Defense (DoD). This award reflects Mosaic Microsystems’ commitment to pushing the boundaries of innovation and its dedication to enhancing national defense capabilities.
Under this Phase II SBIR effort, Mosaic Microsystems will develop ultra-thin glass interposers with through-glass via (TGV) technology. These cutting-edge interposers will serve as the foundation for a high-speed packaging solution designed for analog and digital electronics and photonics. As part of this transformative initiative, in collaboration with the American Institute for Manufacturing Integrated Photonics (AIM Photonics), Mosaic Microsystems’ will demonstrate the integration of fiber optics, waveguides, and photonic integrated circuits (PICs) with glass.
Advanced application-specific integrated circuit (ASIC) or PIC-based systems currently rely on a silicon (Si) substrate for the electronic interposer or electronic and photonic interposer (respectively) and an organic laminate substrate for RF signals, power, and control. Mosaic Microsystems’ effort will leverage the capabilities of AIM Photonics’ Test, Assembly and Packaging (TAP) facility to develop photonics-enabled glass interposers. Mosaic’s glass interposers promise greater efficiency, superior electrical and thermal isolation, and more compact packaging solutions compared to the conventional packages.
This innovative approach will apply not only to defense technology but also to commercial applications. By introducing thin glass photonic interposers, Mosaic Microsystems seeks to demonstrate substantial cost savings, reduced size and weight, and enhanced overall performance over current solutions. These advantages are expected to have far-reaching implications for next-generation digital communications and have the potential to shape the future of 5G and ‘Next G’ technologies.
“This DoD SBIR Phase II contract supports our team’s ability to drive technological innovations in the important area of photonics packaging,” said Shelby Nelson, Chief Technology Officer and Co-Founder at Mosaic Microsystems. “We are thrilled to collaborate with AIM Photonics TAP on this venture, as we help build the future of electronics, photonics, and communications technologies.”
About Mosaic Microsystems:
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS and sensor technologies. We are proud to serve a number of industries and support their business goals with our proprietary technology.
For media inquiries or more information about Mosaic Microsystems and its pioneering work, please contact: Chris Mann, Vice President of Business Development, Chris.Mann@Mosaicmicro.com, 585-298-0198.
About AIM Photonics:
The American Institute for Manufacturing Integrated Photonics (AIM Photonics) is one of nine Manufacturing Innovation Institutes established and managed by the U.S. Department of Defense to advance new technology and capabilities into products and systems that help secure national defense and economic priorities. AIM Photonics enables current and future photonics technologies by integrating photonic components on a silicon wafer fabricated using a standard silicon foundry process. AIM Photonics’ goal is to help U.S. companies—both small and large—develop innovative products and services by providing them with technology on-ramps and access to strategic U.S. government, industry, and academic communities. AIM Photonic offers prototyping services through the Albany NanoTech Complex, the most advanced publicly owned 300 mm wafer R&D facility in the world, and a state-of-the-art 300 mm test, assembly, and packaging (TAP) facility in Rochester, New York, which provides advanced wafer-level and die-level test and assembly for electronic and photonic packaging. More information can be found at www.aimphotonics.com.
Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, has reported winning a Small Business Technology Transfer (STTR) Phase I award to collaboratively develop ultra-low loss solutions for next-generation radar arrays with the University of Florida. The award is sponsored by the Air Force Research Lab (AFRL) under the AFWERX Agility Prime Open Topic.
Mosaic’s thin glass bonded to a carrier provides characteristics such as low loss, CTE match, stability and cost effectiveness particularly desirable for 5G, as well as MEMs and sensors for the Internet of things (IoT). The proprietary Viaffirm™ temporary bond technology uses innovative approaches to support thin glass substrates during downstream processing. This exciting thin glass handling technology allows the supply chain to process thin glass leveraging the existing infrastructure, thereby unlocking the value that thin glass brings to next generation microelectronics and photonics applications.
Dr. YK Yoon, Professor in the University of Florida’s (UF) Department of Electrical and Computer Engineering (ECE) and Director of the Multidisplinary nano and Microsystems (MnM) Laboratory, is a leader in RF and Microwave technology. His group will lead the effort to provide innovative metaconductor technology to low-loss glass substrates, which can result in order of magnitude reduction in loss performance.
AFWERX Phase I STTR
AFRL and AFWERX have partnered to streamline the Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) process in an attempt to speed up the experience, broaden the pool of potential applicants. Beginning in 2018, and now in 2020, the Air Force has begun offering ‘Special’ SBIR/STTR topics that are faster, leaner and open to a broader range of innovations.
This Phase I STTR award through AFWERX is an exciting program that partners Mosaic with the University of Florida ECE Department and the MnM Lab. Combining Mosaic’s innovative thin glass handling technology, the innovative metaconductor technology developed by Dr. Yoon, and MnM’s RF and mmWave experience will allow the development of radar arrays with a step change in low loss, high gain performance. Establishing highly efficient devices has broad application not only in radar arrays but many other needs across the DoD. Combining both of these innovative technologies will provide a dramatic improvement in size, weight and power performance.
Mosaic Chairman and Chief Executive Officer, Christine Whitman, stated “We are excited to work with the University of Florida to enable important revolutionary higher efficiency devices. This technology will have broad adoption across many defense and commercial markets and is an important part of Mosaic’s roadmap.”
Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic packaging. Overcoming the challenges of handling, thinning, and cleaning <200 um thick wafers cost effectively prior to metallization is a key element in providing a robust, scalable process.
Mosaic’s thin glass solutions provide key performance characteristics such as low loss, CTE match, environmental stability, and cost effectiveness particularly desirable for 5G applications, as well as for MEMs and sensors for the internet of things (IoT). The proprietary Viaffirm™ temporary bond technology, uses innovative approaches to support thin glass substrates during downstream processing. This thin glass handling technology allows the supply chain to leverage the existing infrastructure, thereby unlocking the value that thin glass brings to next generation microelectronics and photonics applications.
Axus’ leading-edge CMP systems and tools help improve the polish performance of thin wafers by utilizing the Axus Crystal carrier, specifically designed for ultra-thin and fragile wafers, along with expert process development from our stellar foundry and development lab. Industry needs for glass wafers are being addressed in a prolific way by the processes that support bonding, debonding, and CMP of thin, fragile substrates.
Dan Trojan, President and CEO of Axus, commented “The development of processes and fragile wafer handling capabilities for thin glass wafers that we’re supporting in our partnership with Mosaic Microsystems is something we’re truly excited about. We believe this development will result in compelling solutions to difficult challenges in this evolving and growing market. We and our customers are already deeply involved in these types of applications, as evidenced by several of our recent new product introductions. These include Crystal wafer carriers, Crystal load stations, and last-but-not-least our new, state-of-the-art CapstoneTM CMP system. We believe that all of these products are the best solutions available in the industry for these types of materials and applications.”
Aric Shorey, Vice President of Business Development at Mosaic Microsystems, commented “We have been very pleased to work with Axus for our CMP and finishing needs and appreciate how they have seamlessly employed Mosaic’s Viaffirm™ temporary bond technology into their processes and been successful in finishing substrates as thin as 100 um from the start.”
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About Axus Technology
Axus Technology is a recognized industry leader for equipment and process solutions for CMP, wafer thinning and wafer cleaning applications. Axus enables companies of all sizes from startups to high volume manufacturers to test, develop and implement leading-edge solutions, particularly for novel and emerging materials, process integration schemes, products and applications. Equipment solutions include low cost-of-ownership entry-level tools to state-of-the-art high-volume manufacturing systems. Process testing, development, optimization and scaling are supported by our process applications lab and foundry, which includes a full array of process equipment and supporting metrology, staffed by the most experienced team in the industry. For more information, please visit www.axustech.com.
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS and sensor technologies. We are proud to serve a number of industries and support their business goals with our proprietary technology. For more information, please visit www.mosaicmicro.com.
Mosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning
Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, particularly for 5G, as well as MEMS and sensors for the internet of things (IoT) has reported a significant investment into the business. Christine Whitman, Chairman and CEO of Mosaic Microsystems today announced it has agreed to a $2 million Seed round investment. Madison Hamman, Managing Director of BlueSky Capital, with close ties to Samtec Electronics, led the investment round with participation from Corning Incorporated (NYSE: GLW). Jeremy Wooldridge, General Manager of Samtec Microelectronics, will join Mosaic’s Board of Directors.
The seed financing builds on a strong year for Mosaic including securing an exclusive license from Corning for thin glass handling solutions, a Phase I NASA SBIR Contract to establish manufacturable implementation of thin glass for next generation electronics packaging and a growing list of customers developing their next generation products on thin glass. Mosaic has recruited technology experts from Kodak, Corning and ON Semiconductor to serve on the company’s leadership team.
“Mosaic’s offering is well-timed with the rapidly increasing demand for solutions that expand upon the performance of incumbent material choices, and drive business results,” said Madison Hamman. “We believe the market will continue to require new and differentiated thin substrate solutions for RF communications and advanced packaging. Mosaic is well positioned to establish these solutions for the industry and we are excited to collaborate with and support them as they work to build a great company in an exciting industry.”
Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
At the heart of Mosaic’s solution is a proprietary temporary bond technology, which uses innovative approaches to support thin glass substrates during downstream processing.
Key features and benefits of the Mosaic platform include:
An extremely thin temporary bonding layer, allowing for precision via fill with conductive materials using current semiconductor processes and equipment
Ability to process at elevated temperatures > 400˚C
No outgas from the temporary bond layer
A mechanical de-bond that leverages existing industry processes
“With our patented process, we are unlocking the advantages of thin glass solutions, while fully leveraging well-established processes and equipment in the existing supply chain to maximize the benefits, while minimizing cost,” said Mosaic Chairman and Chief Executive Officer. “With the financial support and domain expertise of Samtec Electronics, we will be able to execute our vision even more rapidly and broadly – and with the benefit of experience, perspective and relationships of our industry.” This investment from BlueSky Capital is the beginning of an exciting relationship with our newest partner with common strategic goals. This investment provides further foundation to build on an excellent 2019 to meet our goals in 2020 and beyond.
About Mosaic Microsystems Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY. Mosaic delivers robust solutions to enable thin glass products for exciting initiatives in RF communications, particularly for 5G, as well as advanced packaging, MEMS and sensors for the internet of things (IoT). Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
About BlueSky Capital BlueSky Capital is venture capital for seed-stage founders focused on component technologies and enabling hardware advances, with a focus on silicon, materials, optics, and sensors. We are independently controlled and financial returns-driven, but with deep ties to Samtec, Inc., that enable us to move quickly and invest with conviction.
Microelectronics and photonics packaging company receives funding to further accelerate technology roadmap
Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, has reported winning Small Business Innovative Research (SBIR) awards from the National Science Foundation (NSF) and Air Force Research Lab (AFRL)/AFWERX.
Mosaic’s glass handling solutions apply particularly for 5G, as well as for MEMs and sensors for the internet of things (IoT). The proprietary temporary bond technology, uses innovative approaches to support thin glass substrates during downstream processing. This exciting thin glass handling technology allows the supply chain to process thin glass leveraging the existing infrastructure, thereby unlocking the value that thin glass brings to next generation microelectronics and photonics applications.
NSF Phase II SBIR
America’s Seed Fund powered by NSF awards $200 million annually to startups and small businesses, transforming scientific discovery into products and services with commercial and societal impact. Startups working across almost all areas of science and technology can receive up to $1.5 million in non-dilutive funds to support research and development (R&D), helping de-risk technology for commercial success.
During the NSF Phase I SBIR project, Mosaic made significant progress on both technical and commercialization fronts establishing facility operations, extending on the base technology to enable commercial applications and providing capability to enable initial company sales. This NSF Phase II funding targets to build on these key achievements to increase process capability, robustness and further increase capacity.
AFWERX Phase I SBIR
AFRL and AFWERX have partnered to streamline the Small Business Innovation Research process in an attempt to speed up the experience, broaden the pool of potential applicants and decrease bureaucratic overhead. Beginning in 2018, and now in 2020, the Air Force has begun offering ‘Special’ SBIR topics that are faster, leaner and open to a broader range of innovations.
This Phase I SBIR award through AFWERX is an exciting program that partners Mosaic with the Electronics and Sensing facility within GE Research. Combining Mosaic’s innovative thin glass handling technology, the capabilities for fabricating advanced RF modules at GE Research and key technology from the Air Force Research Laboratory, allows Mosaic to lead the effort to establish critical next generation antenna technology in the Ka band. This innovative team will be establishing a key technology to enable enhanced satellite communications with significantly reduced size, weight and power. The objective is to leverage the aggressive approach of this AFWERX program to quickly transition the technology to the DoD customers.
Mosaic Chairman and Chief Executive Officer, Christine Whitman, stated “These awards are the culmination of an immense amount of work and focus from the Mosaic team over the past year. This adds to an exciting time for Mosaic as we continue to grow and accelerate our capabilities and work towards growing the business and addressing a wide range of opportunities in both commercial and defense applications.”
About Mosaic Microsystems
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY. Mosaic delivers robust solutions to enable thin glass products for exciting initiatives in RF communications, particularly for 5G, as well as advanced packaging, MEMs and sensors for the internet of things (IoT). Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
About GE Research:
GE Research is GE’s innovation powerhouse where research meets reality. GE’s scientists and engineers originate, develop and productize new technologies that create a better world and deliver differentiated products across the company’s industrial portfolio. These technologies span the defense, aviation, power, transportation and health care sectors. The Electronics and Sensing organization provides advanced prototype-to-production design, fabrication, assembly and test across diverse technologies for the military and industrial base.
Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic packaging. Overcoming the challenges of handling, thinning, and cleaning <200 um thick wafers cost effectively prior to metallization is a key element in providing a robust, scalable process.
