Shelby F. Nelson, Mosaic Microsystems, will present, “Glass Substrate for Packaging” at the iNEMI/ZESTRON workshop, Advanced Packaging and Its Impact on mmWave Applications, November 7 in Manassas, Virginia. This full-day workshop brings together industry-based and academic researchers to talk about the challenges of advanced packaging and its intersection with high-frequency (mmWave) materials. We will also share highlights from the NIST-sponsored 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). Get additional details and make plans to join us in person or virtually.

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