The slowing of Moore’s Law and the increasing demand for devices that integrate multiple functions such as logic, memory, analog, RF, power, MEMS, and photonics into small, power efficient, light weight devices is driving the need for new packaging technologies. Small scale system integration and heterogeneous packaging are taking on increasing importance. New design methods, materials, and manufacturing processes are needed but gaps in the supply chain are delaying their introduction. Mosaic Microsystems is responding to this need by providing critical enabling technologies to the microelectronics industry.
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