Mosaic Microsystems, a pioneering microelectronics and photonics packaging company, today announced strategic leadership changes within its Technology and Manufacturing divisions, signaling a strong commitment to future growth and innovation in advanced substrate solutions.
Effective April 1st, Shelby Nelson, Co-founder and former Chief Technology Officer, has transitioned to the newly created role of Co-founder and Senior Fellow. In this pivotal position, Nelson will continue to contribute her deep technical expertise and vision, which were instrumental in the successful design, development, and launch of Mosaic’s groundbreaking products. Her foundational technology roadmap remains a critical element of the company’s ongoing innovation strategy.
“We extend our deepest gratitude to Shelby Nelson for her visionary leadership and invaluable contributions in establishing Mosaic Microsystems as an industry innovator,” said Christine Whitman, CEO of Mosaic. “Her guidance has been fundamental in taking our initial concepts through to market-leading products, and her continued strategic insights will be crucial as we move forward.”
Building on this strong foundation, David Levy, previously a Senior Scientist at Mosaic, has been promoted to Chief Technology Officer and Vice President of Research & Development. With over 25 years of extensive R&D experience in nano-particle systems, thin film processing, device fabrication, and device physics, Levy will spearhead the advancement of Mosaic’s cutting-edge technical initiatives and drive future innovation.
Further bolstering its operational capabilities, Brian Harding has been elevated from Director of Manufacturing to Vice President of Manufacturing. This promotion recognizes Harding’s significant contributions to scaling Mosaic’s production capabilities and ensuring the delivery of high-quality advanced packaging solutions.
“These strategic leadership appointments underscore Mosaic’s proactive approach to positioning the company for its next phase of expansion,” added Whitman. “As the demand for advanced glass substrates continues to grow within the microelectronics packaging landscape, we are confident that this strengthened leadership team will accelerate our innovation and manufacturing excellence.”
About Mosaic Microsystems
Mosaic Microsystems is a Rochester, NY-based microelectronics and photonics packaging company specializing in enabling glass and other thin substrates as a transformative platform material for a diverse range of applications. These include interposers, RF/mm-Wave technology, MEMS, and advanced sensor technologies. Committed to serving various industries, Mosaic leverages its proprietary technology to empower customers in achieving their critical business objectives. For more information, please visit www.mosaicmicro.com.
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