Mosaic Microsystems co-founder, Shelby F. Nelson, is interviewed about Mosaic’s recent DoD contract and how it will help Mosaic connect chips to photonics and the outside world.
Mosaic Microsystems Lands Phase II Small Business Innovation Research Contract
RBJ spotlights Mosaic for a recent DOD award using its cutting edge glass interposers for an advanced high speed photonics packaging solution. Read the full article here.
Mosaic Microsystems proudly announces the addition of Brittany Hedrick as Senior Engineering Manager. Brittany brings a wealth of experience in silicon photonics integration, wafer finishing, and packaging assembly, which will propel Mosaic’s innovative glass interposer solutions to new heights. Mosaic Microsystems, situated within the Eastman Business Park in Rochester, NY, is renowned for its rapid-paced application of thin glass towards replacing long standing silicon packaging solutions.
Brittany Hedrick joins Mosaic Microsystems from the role of Si Photonics Integration Engineer, with a robust professional background earned over the course of 12 years in the industry. She brings her expertise in a variety of fields, including 2.5D/3D packaging development, Si Photonics Post Fab enablement, and experience in the fabrication of both silicon and glass interposers. From her start as a Process Development Engineer to her role as Lead Post Fab Photonics Integrator, she has acquired a breadth of experience to apply at Mosaic.
“We are thrilled to welcome Brittany Hedrick to our team at Mosaic Microsystems,” said Shelby Nelson CTO of Mosaic Microsystems.
As the Senior Engineering Manager at Mosaic, Brittany will play a pivotal role in shaping the company’s future. Her responsibilities span from overseeing management of new projects to development of new glass packaging solutions. Brittany’s expertise will be instrumental in harmonizing processes, driving innovations in production quality, and addressing the diverse technical challenges presented by Mosaic’s clientele – which ranges from commercial customers to government contracts.
Shelby F. Nelson, Mosaic Microsystems, will present, “Glass Substrate for Packaging” at the iNEMI/ZESTRON workshop, Advanced Packaging and Its Impact on mmWave Applications, November 7 in Manassas, Virginia. This full-day workshop brings together industry-based and academic researchers to talk about the challenges of advanced packaging and its intersection with high-frequency (mmWave) materials. We will also share highlights from the NIST-sponsored 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). Get additional details and make plans to join us in person or virtually.
Mosaic Microsystems co-founder Paul Ballentine and 3D InCites’ Francoise von Trapp discuss how Mosaic is developing thin glass substrates and interposers for advanced packaging in their Rochester, New York fab as one of the only domestic sources.
Mosaic Microsystems, a pioneering leader in advanced microelectronics glass packaging technology, is delighted to announce the successful award of a Phase II Small Business Innovation Research (SBIR) contract by the Department of Defense (DoD). This award reflects Mosaic Microsystems’ commitment to pushing the boundaries of innovation and its dedication to enhancing national defense capabilities.
Under this Phase II SBIR effort, Mosaic Microsystems will develop ultra-thin glass interposers with through-glass via (TGV) technology. These cutting-edge interposers will serve as the foundation for a high-speed packaging solution designed for analog and digital electronics and photonics. As part of this transformative initiative, in collaboration with the American Institute for Manufacturing Integrated Photonics (AIM Photonics), Mosaic Microsystems’ will demonstrate the integration of fiber optics, waveguides, and photonic integrated circuits (PICs) with glass.
Advanced application-specific integrated circuit (ASIC) or PIC-based systems currently rely on a silicon (Si) substrate for the electronic interposer or electronic and photonic interposer (respectively) and an organic laminate substrate for RF signals, power, and control. Mosaic Microsystems’ effort will leverage the capabilities of AIM Photonics’ Test, Assembly and Packaging (TAP) facility to develop photonics-enabled glass interposers. Mosaic’s glass interposers promise greater efficiency, superior electrical and thermal isolation, and more compact packaging solutions compared to the conventional packages.
This innovative approach will apply not only to defense technology but also to commercial applications. By introducing thin glass photonic interposers, Mosaic Microsystems seeks to demonstrate substantial cost savings, reduced size and weight, and enhanced overall performance over current solutions. These advantages are expected to have far-reaching implications for next-generation digital communications and have the potential to shape the future of 5G and ‘Next G’ technologies.
“This DoD SBIR Phase II contract supports our team’s ability to drive technological innovations in the important area of photonics packaging,” said Shelby Nelson, Chief Technology Officer and Co-Founder at Mosaic Microsystems. “We are thrilled to collaborate with AIM Photonics TAP on this venture, as we help build the future of electronics, photonics, and communications technologies.”
About Mosaic Microsystems:
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS and sensor technologies. We are proud to serve a number of industries and support their business goals with our proprietary technology.
For media inquiries or more information about Mosaic Microsystems and its pioneering work, please contact: Chris Mann, Vice President of Business Development, Chris.Mann@Mosaicmicro.com, 585-298-0198.
About AIM Photonics:
The American Institute for Manufacturing Integrated Photonics (AIM Photonics) is one of nine Manufacturing Innovation Institutes established and managed by the U.S. Department of Defense to advance new technology and capabilities into products and systems that help secure national defense and economic priorities. AIM Photonics enables current and future photonics technologies by integrating photonic components on a silicon wafer fabricated using a standard silicon foundry process. AIM Photonics’ goal is to help U.S. companies—both small and large—develop innovative products and services by providing them with technology on-ramps and access to strategic U.S. government, industry, and academic communities. AIM Photonic offers prototyping services through the Albany NanoTech Complex, the most advanced publicly owned 300 mm wafer R&D facility in the world, and a state-of-the-art 300 mm test, assembly, and packaging (TAP) facility in Rochester, New York, which provides advanced wafer-level and die-level test and assembly for electronic and photonic packaging. More information can be found at www.aimphotonics.com.
Mosaic Microsystems, a dynamic manufacturing company in the semiconductor packaging industry, announces the addition of Joshua Roys Ph.D. as a Materials Scientist. Dr. Roys brings chemistry experience in electroplating and polymer systems.
As a material scientist at Mosaic, Roys will play a role in shaping the company’s future. His responsibilities will span from development of new processes for via fill and RDLs and include interfacing with customers. Roys’ expertise will be instrumental in harmonizing processes, driving innovations to production quality, and addressing the diverse technical challenges presented by Mosaic’s clientele, which ranges from commercial customers to government contracts.
“We are delighted to welcome Joshua to our exceptional team at Mosaic Microsystems,” said David Levy, R&D Director of Mosaic Microsystems. “His experience and technical acumen align seamlessly with our commitment to innovation and technical excellence. With Joshua’s contributions we will deliver unique inventive solutions to meet our customer’s needs.”
Mosaic Microsystems, situated within the Eastman Business Park in Rochester, NY, is renowned for its rapid-paced and pioneering approach to semiconductor packaging. Through the application of thin glass technology, the company has achieved unprecedented breakthroughs in microelectronic and photonic interposers, fostering a reputation for excellence.
Rochester, November 28, 2022- Mosaic Microsystems and Chiplet Summit announce that Mosaic Microsystems will be a bronze sponsor of the First Annual Chiplet Summit to be held January 24-26 at the San Jose Doubletree Hotel. The Summit will cover the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, as well as likely breakthroughs and long-term trends. Pre-conference seminars will introduce chiplets and their packaging, test, and integration. Other Summit features include an expert table session (with beer and pizza) and an annual update of technologies and markets.
According to Christopher Mann, “Mosaic Microsystems is proud to be a sponsor of the First Annual Chiplet Summit. We believe that this event will help promote the new chiplet technology, which will revolutionize the way in which leading-edge chips are developed. We will be a leader in the emergence of this new approach.”
According to Chuck Sobey, Chiplet Summit General Chair, “Chiplet Summit welcomes Mosaic Microsystems as a Sponsor of this inaugural event. Industry leaders, like Mosaic Microsystems, will play a major role in the emergence of chiplets through their products, services, and support for developing the chiplet ecosystem.”
About Mosaic Microsystems
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS and sensor technologies. For more information, please visit www.mosaicmicro.com.
About the Chiplet Summit
Chiplet Summit showcases the emerging chiplets market. It features the trends and people leading the adoption of this new technology in designing a wide variety of extremely large integrated chips. The Summit is a product of Semper Technologies.
Contact for Mosaic Microsystems:
Christopher Mann
585-298-0198
chris.mann@mosaicmicro.com
Contact for Chiplet Summit:
Elizabeth Leventhal
760-809-5755
Press@ChipletSummit.com
November 9, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, announced today the hiring of Chris Mann as vice president of business development.
Mann is a highly accomplished senior executive with 40-plus years of success within customer service, telecommunications, semiconductors, hi-tech, optics, data storage, software development and SaaS strategies. In his role at Mosaic Microsystems, he will work closely with internal and external development teams to build strategic partnerships that bring new products, technology and processes to markets in a timely fashion.
“Chris’ extensive proven talent and success, combined with a passion for innovation and getting results, will drive Mosaic’s revenue growth and strategic initiatives,” said Christine Whitman, chairman and CEO. “Chris will also play a key role in the definition and launch of all our customer facing products and technologies that allow our customers to create smarter, faster, and more efficient devices. He brings to the position innovative and inspiring approaches that employ his skills as a business-savvy strategist, creative disruptor and innovator who envisions the art of the possible and successfully delivers results. We are happy to have him on board.”
Most recently, Mann’s extensive experience managing a variety of technical leadership roles includes 13 years as managing partner at TruFocus Technology, Inc., and 17 years as the president and CEO of VoicePort, a developer and provider of configurable and custom self-service advanced speech recognition (ASR) and Web applications.
March 22, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, announced today that it is the recipient of the 2022 3D InCites Award for “Start-up of the Year.”
In its ninth year, the 3D InCites Awards program recognizes industry-wide contributions in the development of heterogeneous integration and 3D technologies. This year, there were a total of 51 nominees in 11 categories, with Mosaic earning a 4-1 vote and the honor of ‘Start-up of the Year.’
Mosaic CTO Shelby Nelson accepting the ‘Start-up of the Year’ award from 3D InCites Editorial Director, Françoise von Trapp
“Congratulations to Mosiac Microsystems and its entire team on this achievement. It’s great to see a start-up that was originally founded by women acknowledged in this way. We are happy to count Mosaic as part of the 3D InCites Community and look forward to supporting its growth,” said Françoise von Trapp, Queen of 3D, 3D InCites.
“We are honored to be selected as “Start-up of the Year” by the 3D InCites Awards panel and the community votes,” stated Shelby Nelson, CTO, Mosaic Microsystems. “As a start-up in advanced packaging, we are grateful for the recognition and proud to be a part of this dynamic community. Thank you to the 3D InCites team for creating this platform for recognition and to our community for voting for Mosaic.”
Founded in 2016, Mosaic Microsystems is a reliable source for thin glass interposers for microelectronic, photonic, RF/mmWave, MEMs and sensor technologies. Mosaic first leased cleanroom space in 2019 and has been shipping glass wafer products ever since. By 2022, Mosaic has grown to a technical team of nine, with experienced leadership from successful serial entrepreneur and CEO, Christine Whitman.
Mosaic’s thin glass wafers with precision through-glass vias (TGVs), are available in a range of integration levels. The simplest are thin TGV glass wafers, made either of fused silica or of glass thermally matched to silicon, bonded to a handle wafer with Mosaic’s proprietary Viaffirm® bond. Viaffirm is stable to temperatures over 400⁰ C, opening up the parameter space that can be used for top surface metallization and passive devices. Mosaic also provides void-free copper via-fill and RDLs, and works closely with customers to provide unique solutions for advanced packaging.
