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Author Archives: David Levy

  1. Mosaic Microsystems will be a sponsor at Chiplet Summit

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    Rochester, November 28, 2022- Mosaic Microsystems and Chiplet Summit announce that Mosaic Microsystems will be a bronze sponsor of the First Annual Chiplet Summit to be held January 24-26 at the San Jose Doubletree Hotel. The Summit will cover the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, as well as likely breakthroughs and long-term trends. Pre-conference seminars will introduce chiplets and their packaging, test, and integration. Other Summit features include an expert table session (with beer and pizza) and an annual update of technologies and markets.

    According to Christopher Mann, “Mosaic Microsystems is proud to be a sponsor of the First Annual Chiplet Summit. We believe that this event will help promote the new chiplet technology, which will revolutionize the way in which leading-edge chips are developed. We will be a leader in the emergence of this new approach.”

    According to Chuck Sobey, Chiplet Summit General Chair, “Chiplet Summit welcomes Mosaic Microsystems as a Sponsor of this inaugural event. Industry leaders, like Mosaic Microsystems, will play a major role in the emergence of chiplets through their products, services, and support for developing the chiplet ecosystem.”

    About Mosaic Microsystems
    Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS and sensor technologies. For more information, please visit www.mosaicmicro.com.

    About the Chiplet Summit
    Chiplet Summit showcases the emerging chiplets market. It features the trends and people leading the adoption of this new technology in designing a wide variety of extremely large integrated chips. The Summit is a product of Semper Technologies.

    Contact for Mosaic Microsystems:
    Christopher Mann
    585-298-0198
    chris.mann@mosaicmicro.com

    Contact for Chiplet Summit:
    Elizabeth Leventhal
    760-809-5755
    Press@ChipletSummit.com

  2. Chris Mann Joins Mosaic Microsystems as Vice President of Business Development

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    November 9, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, announced today the hiring of Chris Mann as vice president of business development.

    Mann is a highly accomplished senior executive with 40-plus years of success within customer service, telecommunications, semiconductors, hi-tech, optics, data storage, software development and SaaS strategies. In his role at Mosaic Microsystems, he will work closely with internal and external development teams to build strategic partnerships that bring new products, technology and processes to markets in a timely fashion.

    “Chris’ extensive proven talent and success, combined with a passion for innovation and getting results, will drive Mosaic’s revenue growth and strategic initiatives,” said Christine Whitman, chairman and CEO. “Chris will also play a key role in the definition and launch of all our customer facing products and technologies that allow our customers to create smarter, faster, and more efficient devices. He brings to the position innovative and inspiring approaches that employ his skills as a business-savvy strategist, creative disruptor and innovator who envisions the art of the possible and successfully delivers results. We are happy to have him on board.”

    Most recently, Mann’s extensive experience managing a variety of technical leadership roles includes 13 years as managing partner at TruFocus Technology, Inc., and 17 years as the president and CEO of VoicePort, a developer and provider of configurable and custom self-service advanced speech recognition (ASR) and Web applications.

  3. Mosaic Microsystems Honored with 3D InCites ‘Start-up of the Year’ Award

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    March 22, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, announced today that it is the recipient of the 2022 3D InCites Award for “Start-up of the Year.”

    In its ninth year, the 3D InCites Awards program recognizes industry-wide contributions in the development of heterogeneous integration and 3D technologies. This year, there were a total of 51 nominees in 11 categories, with Mosaic earning a 4-1 vote and the honor of ‘Start-up of the Year.’

     

    Mosaic CTO Shelby Nelson accepting the ‘Start-up of the Year’ award from 3D InCites Editorial Director, Françoise von Trapp

     

    “Congratulations to Mosiac Microsystems and its entire team on this achievement. It’s great to see a start-up that was originally founded by women acknowledged in this way. We are happy to count Mosaic as part of the 3D InCites Community and look forward to supporting its growth,” said Françoise von Trapp, Queen of 3D, 3D InCites.

    “We are honored to be selected as “Start-up of the Year” by the 3D InCites Awards panel and the community votes,” stated Shelby Nelson, CTO, Mosaic Microsystems. “As a start-up in advanced packaging, we are grateful for the recognition and proud to be a part of this dynamic community. Thank you to the 3D InCites team for creating this platform for recognition and to our community for voting for Mosaic.”

    Founded in 2016, Mosaic Microsystems is a reliable source for thin glass interposers for microelectronic, photonic, RF/mmWave, MEMs and sensor technologies. Mosaic first leased cleanroom space in 2019 and has been shipping glass wafer products ever since. By 2022, Mosaic has grown to a technical team of nine, with experienced leadership from successful serial entrepreneur and CEO, Christine Whitman.

    Mosaic’s thin glass wafers with precision through-glass vias (TGVs), are available in a range of integration levels. The simplest are thin TGV glass wafers, made either of fused silica or of glass thermally matched to silicon, bonded to a handle wafer with Mosaic’s proprietary Viaffirm® bond. Viaffirm is stable to temperatures over 400⁰ C, opening up the parameter space that can be used for top surface metallization and passive devices. Mosaic also provides void-free copper via-fill and RDLs, and works closely with customers to provide unique solutions for advanced packaging.